News
News
200.000 Kontakte auf Wafer kontaktiert
Paricon kontaktiert mit dem leitenden Elastomer PariPoser erfolgreich einen 210x210mm großen Wafer mit ca. 200.000 Kontakten mit 0.45mm Kontaktabstand. Die Kontaktfolie ist 0.11mm dick und sehr oft kontaktierbar. Die Anwendung ist hochstromfähig (20.000A bei 0.8V)......
4-24GHz tunable filters in QFN format by PoleZero
Pole/Zero’s new IMF Series of digitally tunable Bandpass and Notch Filters features accelerated tuning speeds packed in very small, lightweight QFN packages. IMF frequency hopping filters are available in multiple frequency bands across the 4 GHz to 24 GHz frequency...
Vectrawave now partner of RUPPtronik
We are very pleased to announce the cooperation with VectraWave! RUPPtronik is now exclusive partner of the manufacturer of integrated circuits ( MMICs and RFICs ) in chip form up to 70GHz. The low noise amplifiers and power amplifiers of VectraWave are market...
NEL Frequency Controls now with RUPPtronik
We are very pleased about the cooperation with NEL Frequency Controls! RUPPtronik is the exclusive partner of the manufacturer of crystal based oscillators like XO, VCXO, TCXO, OCXO, Dual Frequency Reference Modules. The products feature industry-leading phase noise...
Paricon Test Socket for 77GHz Antenna in Package Modules
RUPPtronik_Paricon_AIP press release
BSC Filters front end switched filter bank
BSC devellopped a DRFM front end filter bank, with 3input and 3outputs allowing fast selection of the IF bandwidth going into an out of the DRFM core. It also permits a fast loop back path for re-transmit of the analogue IF signal. It fits in a single slot VME64...
3.9GHz Ultra Low Phase Noise DRO
Ingenieurbüro Gronefeld pushes the limit of low phase noise and introduces a new 3.9GHz DRO. The DRO features a noise of -180dBc at the floor of and already delivers -126dBc/Hz at 1kHz ofset! The integrated phase jitter is <1fs (1kHz-10MHz). Such results were not...
Paricon contacts 215x215mm wafers directly
Paricon has developed a new wafer connector to directly contact wafer without the need of bond wires or copper pillars. With the revolutionary contacting system PariPoser the wafer is contacted with several hundred thousand connections directly to the PCB....